According to the latest statistics released by the Global Mobile Suppliers Association, as of the middle of November 2020, 122 operators in 49 countries and regions around the world have launched 5G services, and 407 operators in 129 countries and regions are investing in 5G network infrastructure. It is expected that the number of global 5G commercial networks will reach 180 by the end of this year. In addition, many countries around the world have formulated and announced ambitious 5G network investment plans for the next few years in order to boost the economy. It can be expected that the pace of 5G mobile communication infrastructure construction will be further accelerated in the next two to three years.

Liu Zhe, the chief engineer of process research of ZTE Communications Co., Ltd., believes that the high-frequency circuit of 5G products requires lower signal loss, which ushers in changes in antenna materials, PCB substrates, electromagnetic shielding, thermal conductive materials, etc. LCP/MPI will become the mainstream material of 5G terminal antenna FPC; For PCB substrate, Dk/Df is required to be smaller, and the higher the Df is, the more obvious the hysteresis effect is. This requires that resin materials gradually approach PTEE materials, and traditional FR4 resin materials can no longer meet the requirements; For 5G millimeter wave PCB, in order to reduce the line loss, it is necessary to select the solder resist ink with lower Df. The performance of the low Df solder resist ink introduced abroad is 23% higher than that of the conventional ink. In addition, 5G terminals are increasingly mature, the industrial chain is extended upward, technological breakthroughs have been made, and talents have gathered, which has accelerated the localization rate of electronic materials industry. With the popularization of 5G, both mobile terminals and base stations have a large demand for electromagnetic shielding and heat conduction products. The market size of electromagnetic shielding and heat conduction industry is expected to double, with a potential market capacity of more than 12 billion yuan. In the future, electromagnetic shielding materials will develop in the direction of good thermal conductivity, simple processing technology, high cost performance, and be suitable for mass production. Various new materials will get more development in the innovative application of electromagnetic shielding. With the continuous progress of technology, the development of composite materials and the improvement of process, China's thermal conductive phase change materials, thermal conductive silicone grease, thermal conductive filler and thermal conductive gel materials will be further developed, and more new requirements will be put forward for thermal conductive graphite film materials, such as thinner thickness, better thermal conductivity, and processing into 3D structural products or combining with other materials to form composite multifunctional materials.

It shows that after years of development, the material industry has shown remarkable features such as diversified products, industrial concentration and high-speed iteration. Cao Weiran, deputy director of research and development of TCL Huaxing Optoelectronic Technology Co., Ltd., said in his speech that the display technology is constantly changing, and the display devices are developing towards multi-function and digitalization. Large size, high resolution, high color saturation, energy conservation, high brightness, flexibility, transparency, etc. are gradually becoming the mainstream trend of technology development. OLED can finally achieve the above extreme performance.

TCL China Star Photoelectric Focusing Printing Technology (IJP) has made remarkable progress in the layout and development of large size OLED display technology. He emphasized that among IJP-OLED display materials, IJP-OLED Bank and IJP-OLED Ink are extremely important. IJP-OLED Bank material has ink repellent and ink friendly characteristics on different surfaces to ensure no overflow of ink drops and reduce uneven color mixing; IJP-OLED Ink has been distributed by many manufacturers. The solute and solvent systems have been rapidly iterated, and the luminous performance has been continuously improved, which has basically met the application requirements. He said that domestic electronic material enterprises can focus on this field and make contributions to the localization of the display industry.

The rapid development of 5G, automatic driving and the Internet of Things also brings a broad market for high-end chip components. Fu Zhenxiao, the chief engineer of Guangdong Fenghua Hi Tech Co., Ltd., said in his speech that different mobile phones use different MLCCs. The more high-end mobile phones use, the greater the number of MLCCs. At present, there are more than 1100 MLCCs in the iPhone X and more than 10000 MLCCs in an electric vehicle. Therefore, the demand of the future market is expected. The development of chip components towards miniaturization, thinness, high performance and high reliability also poses new challenges to electronic materials. Core materials such as high-end dielectric materials, electronic pastes and key auxiliary materials such as PET films need to be broken by domestic material enterprises.